Effect of Ultrasonic Vibration on Wire Bonding

Investigation of ultrasonic vibrations of wire-bonding capillaries

Ultrasonic energy is widely used in wire bonding for microelectronics packaging. It is necessary to ensure that the maximum ultrasonic vibration displacement occurs at or near the tip of the bonding tool (capillary) for optimal performance. In this study, amplitude profiles of ultrasonic vibrations along capillaries were measured with load using a laser interferometer. This provided valuable in...

Performance Study of an Ultrasonic Transducer used for Wire Bonding

-In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreem...

Ultrasonic friction power during Al wire wedge-wedge bonding

Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25 m diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultraso...

Effect of Ultrasonic Vibration on Proliferation and Differentiation of Cells

The effect of mechanical stimulation of vibration on proliferation and differentiation of cells has been studied in vitro. To apply the vibration on the cells, a piezoelectric element was attached on the outside surface of the bottom of the culture plate of six wells. The piezoelectric element was vibrated by sinusoidally alternating voltage at 1.0 MHz generated by a function generator. Five ki...

Effect of Ultrasonic Vibration on the Metallurgical Properties of Steel